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Fan-Out Wafer-Level Packaging

R 6,561

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Availability: Currently in Stock

Delivery: 10-20 working days

Condition: USED (All books are in used condition)

Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.

Fan-Out Wafer-Level Packaging
Country USA
Brand Springer
Manufacturer Springer
Binding Hardcover
ItemPartNumber 150 Tables, color; 226 Illustrations, co
ReleaseDate 2018-04-13
UnitCount 1
EANs 9789811088834

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Country	USA
Brand	Springer
Manufacturer	Springer
Binding	Hardcover
ItemPartNumber	150 Tables, color; 226 Illustrations, co
ReleaseDate	2018-04-13
UnitCount	1
EANs	9789811088834